Ohashi Engineering offers a wide range of ACF processing equipment, specializing in high-volume solutions. Ohashi has equipment to handle more traditional flex-on-glass (FOG) or chip-on-glass (COG) applications as well as equipment designed for more recent ACF uses such as touch panel assembly or camera module assembly. With lines capable of handling more than 40,000 bonds per day, nobody beats Ohashi's combination of quality, price, performance, and throughput.