High performance in advanced semiconductor manufacturing processes like SiP.
● Significantly increased throughput resulting from shortening idle time by approximately 40%.
● Ultra-fine dispensing with a resolution of 1μm.
● Reduction in machine width by 30% compared to other machines with similar capabilities.
● Ultra-high speed dispensing when mounted with a non-contact jet dispenser.
● Good ergonomics and ease of operation.
● Additional Info